Visit NOV<span style='color:red'>OS</span>ENSE at PCIM Europe 2026！
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Visit NOVOSENSE at PCIM Europe 2026！

　　We warmly invite you to visit NOVOSENSE at PCIM Europe 2026. Discover how NOVOSENSE empowers innovation across automotive electronics, renewable energy & power supply, and industrial control with a comprehensive portfolio of isolators, interfaces, drivers, sensors, signal chain, and power management ICs.　　Date: June 9–11, 2026　　Venue: Nuremberg Exhibition Centre, Germany　　Booth: Hall 4A, Booth 119　　✦ What to Expect ✦　　Functional safety ICs for safety-critical automotive systems　　One-stop body control & automotive lighting solutions　　SerDes and ultrasonic radar IC solutions for smarter mobility　　Technical presentations on high-voltage electric mobility and AI data center power systems　　✦ Highlights Preview ✦　　Functional Safety ICs for Safety-Critical Automotive Systems　　Isolated gate driver NSI6911F — certified by TÜV Rheinland to meet ISO 26262 ASIL D requirements, featuring up to 19A peak drive capability, ±150kV/μs CMTI, an integrated 12-bit isolated ADC, and advanced diagnostic functions for high-voltage applications such as traction inverters, OBCs, and DC-DC converters.　　ASIL B ultrasonic radar ASSP NSUC1800 and LED driver NSL21924FS , reflecting NOVOSENSE's expanding functional safety portfolio across sensors, signal chain, power management, and driver ICs.　　One-Stop Automotive Body Control & Lighting Solutions　　For BCM and ZCU applications, NOVOSENSE offers motor driver products for brushed DC motors, stepper motors, BLDC motors, relays, valves, and solenoids, supporting efficient, precise, and safe motor control.　　For automotive lighting, NOVOSENSE will showcase full-scenario LED driver solutions for ambient lighting, reading lights, headlighting, rear lighting, ISD/ISC lighting, grille lighting, and more, helping create safer, smarter, and more distinctive vehicle lighting experiences.　　Enabling Smarter Mobility with SerDes and Ultrasonic Radar IC Solutions　　SerDes chipset — NLS9116 single-channel serializer and NLS9246 four-channel deserializer, designed for cameras, displays, and domain controllers in ADAS and intelligent cockpit systems.　　AK2 ultrasonic radar ASSP — comprising the NSUC1800 sensor-side chip and NSUC1802 host-side interface conversion chip, providing a turnkey solution for applications such as UPA and APA.　　✦ Keynote Speeches ✦　　Join NOVOSENSE experts at PCIM Europe 2026 for in-depth technical presentations on how advanced semiconductor technologies are addressing the evolving demands of high-voltage electric mobility and AI data center power systems.　　E-Mobility & Energy Storage Stage　　Hall 6, Booth 220　　Topic: Evolution and Challenges of Gate Driver Technology for New Generation of xEV Powertrain System　　Time: June 9, 2026 | 15:25–15:45 (GMT+1)　　Speaker: Timmy Wu　　Topic: Enabling EV High-Voltage Safety with Advanced Isolated Sensing　　Time: June 11, 2026 | 12:05–12:25 (GMT+1)　　Speaker: Lillian Liu　　AI & Data Centers Stage　　Hall 5, Booth 320　　Topic: Power Density Scaling in AI Data Centers: From System Constraints to Semiconductor Device Challenges　　Time: June 9, 2026 | 14:35–14:55 (GMT+1)　　Speaker: Wenzhe Xu
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Release time：2026-05-14 11:40 reading：514 Continue reading>>
ARM CEO Says Agentic AI May Drive CPU Core Counts to 512 as GPU-CPU Ratios Become Less Relevant
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ARM CEO Says Agentic AI May Drive CPU Core Counts to 512 as GPU-CPU Ratios Become Less Relevant

　　The rise of agentic AI is fueling fresh debate over the future GPU-to-CPU balance in AI systems, with Arm CEO Rene Haas now weighing in on the discussion. According to a transcript published by Investing.com, Haas said that while CPUs may not outnumber GPUs on a chip basis, they could from a core-count perspective.　　Haas noted that overall CPU demand is likely to increase significantly as agentic AI scales, with data centers potentially requiring more than four times today’s CPU capacity. He said this could create a data center CPU market opportunity exceeding US$100 billion by 2030.　　At the same time, Haas emphasized that the industry is seeing not only an explosion in overall CPU demand, but also rapid growth in the number of cores per CPU. According to Haas, many agentic AI workloads involve independent jobs, flows, or batches running on dedicated CPU cores, increasing the need for higher-core-count processors.　　Haas used Blackwell, Rubin, and other large AI accelerators as examples, noting that these chips are already approaching reticle limits, meaning their size is constrained by the maximum area a lithography mask can print. In contrast, he said CPU core counts could still double or even quadruple over the coming years.　　Haas noted that the Arm AGI CPU already features 136 cores, significantly higher than many competing offerings. Looking ahead, he said the industry is likely to move toward 256-core and even 512-core CPU designs. He added that such high-core-count architectures play to Arm’s strengths, as efficiency per core becomes increasingly critical at larger scales.　　Mydrivers notes that AMD and Intel are moving in a similar direction. AMD’s 2nm Zen 6-based EPYC processors are already expected to reach up to 256 cores with SMT multithreading support, while Intel’s all-E-core Xeon processors have reached 288 cores, with the next generation expected to scale to as many as 512 cores.　　Regarding the Arm AGI CPU launched at the company’s Arm Everywhere event last quarter, Haas said customer response has been “very strong.” He added that customer demand across fiscal 2027 and fiscal 2028 has already exceeded US$2 billion, more than double the level projected at launch.
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Release time：2026-05-11 13:48 reading：442 Continue reading>>
NOV<span style='color:red'>OS</span>ENSE Launches Next-Generation Isolated CAN Transceiver NSI1150, Supporting ±70V Bus Fault Protection and Higher Data Rates
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NOVOSENSE Launches Next-Generation Isolated CAN Transceiver NSI1150, Supporting ±70V Bus Fault Protection and Higher Data Rates

　　NOVOSENSE today announced the launch of its new industrial-grade isolated CAN transceiver, the NSI1150 series. Built on NOVOSENSE's third-generation isolation technology, the device delivers ±70V bus fault protection and up to ±150kV/μs (typical) common-mode transient immunity (CMTI). Compared to the previous generation (NSI1050), the NSI1150 achieves a comprehensive improvement in reliability and noise immunity. It also integrates NOVOSENSE's proprietary CAN FD transceiver, supporting communication speeds of up to 5 Mbps.　　The NSI1150 is available in multiple package options, including SOW16, SOW8, SOP8, SOWW8, and DUB8, addressing diverse design requirements. It is well suited for high-voltage, high-noise, multi-node applications such as industrial automation and control, energy and power systems, as well as communications and servers.　　Reliability Upgrade for Harsh Environments　　The NSI1150 delivers industry-leading reliability and robustness, featuring a high CMTI of ±150kV/μs (typical) and ±70V bus fault protection, enabling it to effectively handle strong electromagnetic interference and ground potential differences in demanding environments.　　In addition, all pins support ±6kV HBM ESD protection and 10kV surge capability across the isolation barrier, ensuring stable communication even under extreme conditions. The device offers multiple isolation ratings—3 kVRMS, 5 kVRMS, and 7.5 kVRMS—to meet stringent safety requirements across various applications, reinforcing system protection in critical sectors such as industrial automation and energy infrastructure.　　Multiple Package Options for Flexible Design　　The NSI1150 is offered in five mainstream package options—SOW16, SOW8, SOP8, SOWW8, and DUB8—accommodating different space constraints and safety requirements. Among them, the newly introduced SOWW8 wide-body package provides up to 15 mm creepage distance, making it ideal for applications with strict creepage requirements, such as photovoltaic systems, EV charging stations, and industrial power supplies.　　This extended creepage distance simplifies safety certification processes and enables more flexible layout design for high power density systems. The diversified package portfolio further enhances design flexibility and accelerates time-to-market.　　"Isolation+" Portfolio Setting Industry Benchmark　　Leveraging its deep expertise and technological leadership in isolation, NOVOSENSE offers a comprehensive "Isolation+" portfolio, including digital isolators, isolated sensing, isolated interfaces, isolated power, and isolated drivers.　　NOVOSENSE is building a robust safety foundation for high-voltage systems with its full "Isolation+" ecosystem:　　"+" stands for enhanced safety: NOVOSENSE products deliver safety levels exceeding basic isolation standards, and build a more reliable system isolation safety boundary for customers' systems.　　"+" stands for full product ecosystem: With mature capacitive isolation technology IP as the cornerstone, expand into a complete product portfolio to provide one-stop isolation solutions.　　"+" stands for in-depth application empowerment: Meet the emerging needs of scenarios including electric vehicle high-voltage platforms, high-power photovoltaic-storage-charging systems, and high-integration, high-efficiency AI server power supplies, enabling system-level safety, reliability and efficiency.　　With its comprehensive "Isolation+" product strategy—anchored by core technology IP and a full ecosystem—NOVOSENSE continues to set the benchmark in isolation semiconductors, delivering one-stop isolation solutions to customers worldwide.　　Previous:
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Release time：2026-04-24 10:58 reading：587 Continue reading>>
ROHM Develops 5th Generation SiC M<span style='color:red'>OS</span>FETs with Approx. 30% Lower On-Resistance at High Temperatures
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ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures

　　ROHM has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers.　　In recent years, the rapid proliferation of generative AI and big data processing has accelerated the deployment of high-performance servers in the industrial equipment sector. The resulting surge in power density is placing a greater strain on power infrastructure, raising concerns about localized supply shortages. While smart grids that combine renewable energy sources (i.e., solar power) with existing power supply networks are emerging as a possible solution, minimizing losses during energy conversion and storage remains a key challenge.　　In the automotive sector, next-generation electric vehicles require extended cruising range and faster charging, creating demand for lower-loss inverters and higher performance onboard chargers (OBCs). Against this backdrop, the adoption of SiC devices capable of both low loss and high efficiency is increasing in high-power applications ranging from a few kilowatts to hundreds of kilowatts.　　As the first semiconductor company globally, ROHM was the first in the world to begin mass production of SiC MOSFETs in 2010, contributing to reducing energy losses by implementing SiC devices over a wide range of high-power applications, including offering an early lineup of products compliant with automotive reliability standards such as AEC-Q101. Furthermore, the 4th generation SiC MOSFETs, for which sample provision began in June 2020, have been adopted globally in automotive and industrial applications. They are available across a broad product portfolio, including both discrete devices and modules, supporting the rapid market adoption of SiC technology.　　The newly developed 5th Generation SiC MOSFETs achieve industry-leading low loss, driving the broader adoption of SiC technology. Through structural enhancements and manufacturing process optimization, ON resistance is reduced by approximately 30% during high temperature operation (Tj=175°C) compared to conventional 4th Generation products (under the same breakdown voltage and chip size conditions). This improvement contributes to making units smaller while increasing output power in high temperature applications such as traction inverters for xEVs.　　ROHM began supporting the bare dies business with 5th Generation SiC MOSFETs in 2025 and completed development in March 2026. Furthermore, starting from July 2026, ROHM will provide samples of discrete devices and modules incorporating 5th Generation SiC MOSFETs.　　Going forward, ROHM plans to expand its 5th Generation SiC MOSFET lineup with additional breakdown voltage and package options. ROHM will also continue to enhance its design tools and strengthen application support. By further promoting the implementation of SiC technology – now entering the mainstream phase – ROHM contributes to more efficient power utilization across a wide variety of high-power applications.　　Application ExamplesAutomotive Systems: xEV traction inverters, onboard chargers (OBCs), DC-DC converters, electric compressors　　Industrial Equipment: Power supplies for AI servers and data centers, PV inverters, ESS (Energy Storage Systems), UPS (Uninterruptible Power Supplies), eVTOL, AC servos　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops the core technologies needed to advance SiC devices completely in-house, from wafer fabrication and process development to packaging and quality control. At the same time, we have established a fully integrated production system that spans the entire manufacturing flow, solidifying our position as a leading SiC supplier.
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Release time：2026-04-24 10:34 reading：456 Continue reading>>
ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V M<span style='color:red'>OS</span>FET Lineup
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ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

　　ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs for automotive applications – such as main inverter control circuits, electric pumps, and LED headlights – by introducing latest products adopting the new HPLF5060 package (4.9mm × 6.0mm).　　In recent years, automotive low-voltage MOSFETs have been trending toward smaller packages, such as the 5060-size and even more compact options. However, this miniaturization introduces significant challenges for achieving reliable mounting, primarily due to narrow terminal spacing and leadless designs.　　To address these issues, the new HPLF5060 package offers a smaller footprint compared to the widely used TO-252 package (6.6mm × 10.0mm) while enhancing board-mount reliability through the adoption of gull-wing leads. Additionally, the use of copper clip junction technology enables high-current operation, making the HPLF5060 an ideal solution for demanding automotive environments.　　Mass production of new products using this package began in November 2025 (sample price: $3.5/unit, excluding tax).　　In addition to expanding the lineup of products using this package, mass production of the smaller DFN3333 (3.3mm × 3.3mm) package, which employs wettable flank technology, is scheduled to begin around February 2026. Furthermore, development has commenced on a TOLG (TO-Leaded with Gull-wing) package (9.9mm × 11.7mm) to further expand the lineup of high-power, high-reliability packages.　　☆ : Under Development　　Application Examples　　Main inverter control circuits, electric pumps, LED headlights, etc.　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector. Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　・EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Gull-Wing Leads　　A terminal structure that spreads outwards from both sides of the package. It achieves excellent heat dissipation along with increased mounting reliability. It is called “Gull-Wing” because its appearance resembles the wing of a seagull.　　Copper Clip Junction Technology　　A technology that uses copper clips (flat metal bridges) to connect chips and lead frames directly, replacing the conventional wire bonding method.　　Wettable Flank Technology　　A technology for plating the sides of the lead frame on bottom electrode packages such as QFN and DFN to improve mounting reliability.
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Release time：2026-02-25 17:46 reading：641 Continue reading>>
NOV<span style='color:red'>OS</span>ENSE and Inovance Automotive Co-Develop IC Solutions for Next-Generation Electric Drive Platforms
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NOVOSENSE and Inovance Automotive Co-Develop IC Solutions for Next-Generation Electric Drive Platforms

　　NOVOSENSE Microelectronics announced that two highly integrated ICs—an isolated sensing IC and a logic ASC IC—developed in close collaboration with Inovance Automotive, a leading supplier of intelligent electric vehicle components and solutions, have entered mass production on Inovance Automotive’s next-generation electric drive (e-drive) platform. The customized IC solutions offer higher integration and optimized performance, supporting the ongoing shift toward more integrated electric drive systems while enabling designs that meet increasingly stringent functional safety requirements.　　Conventional discrete electric drive designs rely on widely distributed components and complex wiring, often resulting in larger system size, higher power losses, slower response, and constrained reliability. As electric vehicles continue to demand longer driving range and higher output power, electric drive architectures are moving rapidly toward multi-in-one and highly integrated designs. In this context, semiconductor solutions must deliver greater functional integration while maintaining accuracy, reliability, and functional safety margins within limited space, without constraining system-level design flexibility.　　Building on more than a decade of experience in motor controller system architectures and functional safety, Inovance Automotive proactively defined the key functional and performance requirements for the isolated sensing IC and logic ASC IC at an early stage of development. In response to these requirements, NOVOSENSE integrated high-voltage LDO, isolated sensing amplifier, and isolated comparator into a single isolated sensing IC. This integration significantly reduces external component while enabling high-precision isolated voltage sensing, fast OV/UV protection, and more compact electric drive designs.　　The customized logic ASC IC further integrates multiple logic functions and supports frequency detection, enabling centralized handling of interface-related logic. This approach simplifies interface design, improves overall system integration, and supports more compact inverter layouts. At the same time, it helps reduce BOM cost and provides a solid foundation for optimizing functional safety architectures in electric drive and traction inverter systems.　　By replacing mature discrete circuits with integrated IC solutions, the collaboration delivers clear system-level benefits.　　Simplified architectures and fewer components reduce potential failure points and improve overall product robustness.　　Higher integration lowers PCB area requirements, creating additional headroom for increased power density.　　Standardized IC solutions also streamline development by reducing design and validation effort, helping shorten development cycles and accelerate time-to-market.　　"Electric drive systems are entering a phase where higher integration is becoming essential, and progress at the chip level increasingly translates into system-level advantages," said Zheng Chao, Director of the R&D Center at Inovance Automotive. "This collaboration combines our strengths in electric drive systems with NOVOSENSE’s expertise in automotive semiconductors. More importantly, it reflects an important capability upgrade for Inovance Automotive—we are not only developing high-performance power electronics products, but also participating from the outset in defining system architectures and core chips. We look forward to continuing our work with NOVOSENSE to shape next-generation electric drive platforms and deliver more competitive system solutions to OEMs."　　"NOVOSENSE and Inovance Automotive have established a strong foundation for collaboration," said Ye Jian, Product Line Director at NOVOSENSE. "This project demonstrates both our customer's confidence in our technology and our application-driven approach to innovation. By drawing on our long-standing expertise in isolation and interface technologies, we will continue to deliver high-precision, high-performance, and high-reliability IC solutions to support Inovance Automotive's next-generation electric drive platforms."　　NOVOSENSE's Isolation+ portfolio covers digital isolator, isolated sensing, isolated driver, isolated power, and isolated interface, with cumulative shipments exceeding two billion units as of October 2025. The company also offers a broad automotive interface portfolio—including CAN, LIN, SerDes, logic ICs, and level shifters—providing customers with one-stop automotive-grade isolation and interface solutions. Across the new energy vehicle electrical system, NOVOSENSE works with hundreds of component suppliers, delivering semiconductor solutions for traction inverter, onboard charger (OBC), DC/DC converter, and battery management system (BMS), spanning sensor, signal chain, power management IC, and MCU.
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Release time：2026-02-25 17:36 reading：1011 Continue reading>>
BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award
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BIWIN Mini SSD Earns Dual Honors: TWICE Picks Award and AVRONA Most Innovative Award

　　Recently, BIWIN’s innovative product Mini SSD was honored with multiple international awards at CES 2026, earning the TWICE 2026 Picks Awards Winner as well as the AVRONA Most Innovative Award.　　With its breakthrough design philosophy and strong technical capabilities, this “small form factor, superior performance” storage solution not only continues BIWIN’s legacy of technological innovation, but also aligns seamlessly with the accelerating evolution of edge AI.　　Technological Breakthroughs Addressing Core Storage Challenges　　Conventional consumer storage solutions have long struggled to balance performance, portability, and expandability. BIWIN Mini SSD overcomes these limitations through three key innovations:　　AdvancedLGA packaging, compressing the form factor to just 15 × 17 × 1.4 mm (approximately the size of half a coin) and supporting capacities from 512GB to 2TB;　　PCIe 4.0 ×2interface with NVMe 1.4 protocol, delivering read speeds of up to 3700MB/s and write speeds of 3400MB/s, far surpassing traditional storage card solutions and rivaling mainstream consumer-grade M.2 SSDs;　　An industry-first standardized slot-in SSD design, enabling effortless TB-level expansion through a simple “open – insert – lock” three-step process, dramatically simplifying storage upgrades.　　Small in Size, Big in Capability: Empowering Two Key Tracks　　For consumers, BIWIN Mini SSD introduces a new level of convenience as no specialized tools are required for individuals to expand storage capacity, and its flagship-class performance is capable of supporting smooth operation of intelligent devices.　　For device manufacturers, its standardized interface, modular architecture, and scalability significantly streamline BOM management, reduce manufacturing, inventory, and after-sales costs, and support optimization across the entire product lifecycle.　　The product has already entered deep collaborations with well-known brands such as One-Netbook (ONEXPLAYER) and GPD, helping partners build differentiated competitive advantages in the market.　　Global Recognition Validating Technical Excellence　　Leveraging its ultra-compact design, high scalability, and reliable performance, BIWIN Mini SSD is redefining the integrated paradigm between AI terminals and storage technologies. Thanks to its disruptive innovation, the product was selected for TIME’s “Best Inventions of 2025”, becoming the only storage product worldwide to make the list.　　It subsequently won the “Best-in-Show” Award at Embedded World North America 2025, earning strong endorsement from industry authorities for both its technological advancement and commercialization potential. The dual awards at CES 2026 further reinforce the product’s real-world value and promising market outlook.　　Most notably, the latest achievement marks another milestone: BIWIN Mini SSD has been shortlisted as a finalist for the 2026 Edison Awards, often referred to as the “Oscars of Innovation.” This prestigious recognition, honoring the world’s most outstanding innovations, adds another heavyweight accolade to BIWIN Mini SSD’s growing global honors portfolio.
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Release time：2026-02-06 17:44 reading：973 Continue reading>>
A new choice for high-accuracy, highly compatible current sensing: NOV<span style='color:red'>OS</span>ENSE launches the NSCSA21x-Q series high-precision current sense amplifiers
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A new choice for high-accuracy, highly compatible current sensing: NOVOSENSE launches the NSCSA21x-Q series high-precision current sense amplifiers

　　NOVOSENSE has launched the NSCSA21x-Q series high-precision current sense amplifiers, offering a –2V to 28V common-mode input range, ultra-low ±5μV offset voltage, 130dB CMRR, and 200kHz bandwidth. Designed to meet the needs of new energy vehicles, server power supplies, telecom power systems, and energy storage, the NSCSA21x-Q series delivers exceptional accuracy and system stability in demanding environments.　　Addressing Key Challenges in Modern Power and Automotive Systems　　As automotive electrification and industrial intelligence advance, current sensing accuracy and system stability have become critical to overall performance. Traditional current sensors often face limitations in low-voltage detection, reverse connection protection, and dynamic response, impacting system reliability and efficiency. The NSCSA21x-Q series directly targets these pain points, overcoming three major challenges in precision current detection:　　(1) High-Precision Motor Phase Current Sampling　　Supports bidirectional current sensing in H-bridge structures. Combined with FOC algorithms, it enables ±0.5° electrical angle control for precise motor performance.　　(2) Suppression of Parasitic Inductance Interference　　In low-side sensing, the NSCSA21x-Q effectively mitigates “ground bounce” effects through PWM rejection, maintaining high accuracy even with small current signals. With a 130dB CMRR and only ±5μV input offset, it ensures signal integrity under severe transient conditions.　　(3) Reverse Battery Protection　　Withstands up to –28V reverse voltage, safeguarding the system against battery misconnection and simplifying protection circuit design.　　Robust Performance Across All Operating Conditions　　Breaking conventional design limits, the NSCSA21x-Q series supports a wide –2V to 28V common-mode range with built-in PWM suppression and chip-level reverse-voltage tolerance. Even under –28V reverse common-mode stress, the device quickly resumes normal operation. In rigorous transient tests (–2V to 12V step change), it achieves a <5μs recovery time and <50mV output disturbance, making it ideal for high-accuracy current detection in motor drives and solenoid control under PWM switching environments.　　Precision and Stability Across Temperature Extremes　　Featuring a ±5μV (typical) input offset voltage and ±0.5% maximum gain error, the NSCSA21x-Q maintains outstanding accuracy over a full –40°C to 125°C temperature range. With a temperature drift as low as 0.05μV/°C, it ensures stable measurements in harsh automotive and industrial conditions.Input Offset Voltage Distribution of NSCSA21x-Q SeriesCommon-Mode Rejection Ratio (CMRR) Distribution of NSCSA21x-Q Series　　Fast Dynamic Response and Strong Transient Protection　　With a 200kHz bandwidth (50V/V gain) and a 2V/μs slew rate, the NSCSA21x-Q supports fast current variation monitoring and real-time protection. Compared to mainstream alternatives, it achieves up to 3× faster transient response, meeting the needs of high-speed applications such as motor control and power protection.　　Flexible Configurations with Automotive-Grade Reliability　　The NSCSA21x-Q series offers four fixed gain options (50V/V, 75V/V, 100V/V, and 200V/V), covering both industrial and automotive versions. Packaged in an ultra-compact SC70-6 (2mm × 1.25mm) footprint, it's pin-compatible with industry standards, enabling smaller system size and higher design efficiency.Four Fixed-Gain Versions of the NSCSA21x-Q Series　　The NSCSA21x-Q series is AEC-Q100 Grade 1 qualified, supporting –40°C to +125°C operation and ensuring long-term reliability in automotive environments.
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Release time：2026-01-15 17:20 reading：2118 Continue reading>>
Swift Navigation and SIMCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning
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Swift Navigation and SIMCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning

　　SIMCom's GNSS Modules Now Integrated with Swift's Skylark Precise Positioning Service　　SAN FRANCISCO, CA – October 28, 2025 – Swift Navigation, a leader in precise positioning technology for mass-market applications, and SIMCom, a leading global IoT wireless modules and solutions supplier, today announced a partnership to deliver centimeter-level GNSS accuracy to high-volume robotics applications worldwide.　　The collaboration integrates Swift's Skylark™ Precise Positioning Service with SIMCom's high-performance SIM66MD and SIM66D GNSS modules.　　This powerful combination allows manufacturers and developers using these modules to easily activate centimeter-accurate satellite positioning, dramatically improving the performance, safety, and reliability of robotic lawnmowers, delivery robots, agricultural vehicles, and other autonomous systems. SIMCom's modules are renowned for their compact designs, low power consumption, and wide array of interfaces, making them ideal for seamless integration into diverse IoT and autonomous devices.　　Swift's Skylark Nx RTK, the highest-precision variant of Skylark, leverages a proprietary atmospheric model to deliver continuous 1-2 cm accuracy across vast geographic areas, including all of Western Europe. This carrier-grade network eliminates the need for developers to manage base stations or switch between multiple correction providers, simplifying the deployment of high-precision outdoor robots at scale.　　"SIMCom's commitment to high performance and versatile design in their GNSS modules aligns perfectly with Swift’s mission to make high-precision positioning accessible and scalable," said Daniel Optendrenk, Vice President of Sales and Business Development at Swift Navigation. "By integrating Skylark with the SIM66MD and SIM66D, we are directly addressing the critical need for reliable, low-cost precision in outdoor autonomous systems, giving developers the tools they need to achieve truly seamless operation."　　"The demand for high-accuracy, low-power positioning is growing across all our target segments, particularly in the emerging field of autonomous robotics," said Chunlin Zhu, GNSS Product Line Director at SIMCom. "This partnership ensures that our popular modules can immediately access Swift’s leading precise positioning network, providing a seamless path for our customers to achieve centimeter-level accuracy and gain a competitive edge in deploying fully autonomous solutions."　　Key benefits for autonomous navigation:　　● Autonomous Operation: Centimeter-level accuracy is essential for robots to execute complex tasks, such as following precise mowing patterns, planting seeds with exact spacing, or navigating narrow construction sites.　　● Safety and Geofencing: Precise localization enables reliable enforcement of virtual boundaries (geofencing), preventing robots from entering restricted zones or colliding with obstacles, which is critical for safety in public or shared spaces.　　● Improved Efficiency: Reliable 1-2 cm precision reduces path errors, minimizes overlap in coverage (e.g., in farming or lawn care), and ensures the robot consistently reaches its exact target destination, maximizing battery life and operational uptime.
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Release time：2026-01-13 17:01 reading：1709 Continue reading>>
Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future
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Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.
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Release time：2026-01-13 14:59 reading：1947 Continue reading>>

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